Monitoring 3-D Temperature Distributions and Device Losses in Power Electronic Modules

Christoph H. van der Broeck, Robert D. Lorenz, Rik W. De Doncker; IEEE Transactions on Power Electronics, November 2018

Monitoring 3-D Temperature Distributions and Device Losses in Power Electronic Modules

This paper presents a methodology for real-time monitoring of 3-D temperature distributions and device losses within power electronic modules. It allows precise thermal management, empirical lifetime prognosis and detection of critical degradation of the power module. By effective combination of thermal 3-D finite difference modeling, parametric loss models and model truncation techniques a compact thermal real-time model is derived. It enables the computation of device losses and temperatures at critical locations within a power module, e.g. at the devices, solder interfaces or the base plate, on a conventional digital signal processor. The real-time model as well as real-time junction temperature information are combined in a new Luenberger-style observer structure. Applying bandwidth-partitioning, the observer estimates the temperatures throughout the power module every switching period and averaged over one excitation period with nearly zero lag, even if the junction temperature measurement exhibits delays and has noisy signals. Furthermore, it estimates errors in the loss prediction process that can be tracked over the lifetime of the power module to detect degradation of the devices or the power module. The observer and its features are experimentally evaluated under realistic operating conditions on a load emulator using a state-of-the-art automotive power module.

Link: IEEE Xplore