3D-Printed Fluid-Cooler Baseplate for Si-IGBT Modules

Bündgen, David; Stippich, Alexander; de Doncker, Rik W. (Corresponding author)

Berlin : VDE Verlag GmbH (2020)
Contribution to a book, Contribution to a conference proceedings

In: PCIM Asia : international Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 16-18 November 2020, Shanghai, China : proceedings / Organizer: Guangzhou Guangya Messe Frankfurt Co Ltd., Guangzhou, China
Page(s)/Article-Nr.: 135-139