Highly Integrated Switching Cell Design based on Copper Diamond Heat Spreader, 3D Printed Heat Sink and HTCC Logic Board

Sewergin, Alexander; Rittner, Martin; Burghardt, Andreas; Kriegel, Kai; Mitic, Gerhard; Zetterer, Thomas; Hutsch, Thomas; Neumann, Albert; Simon, Flaviu; de Doncker, Rik W. (Corresponding author)

Berlin ; Offenbach : VDE Verlag GmbH (2020)
Contribution to a book, Contribution to a conference proceedings

In: CIPS 2020 : 11th International Conference on Integrated Power Electronics Systems : March, 24-26, 2020, Berlin, Germany / VDE ETG
Page(s)/Article-Nr.: 397-402

Identifier