Enhancing Lifetime of Power Electronic Modules via Thermal Buffers

Stippich, Alexander; van der Broek, Christoph H.; De Doncker, Rik W.

Piscataway, NJ : IEEE (2020)
Contribution to a book, Contribution to a conference proceedings

In: ECCE 2020 : IEEE Energy Conversion Congress & Expo, Detroit, Michigan, October 11-15 / sponsored by the IEEE Power Electronics and Industry Applications Societies ; IEEE ; general chair: Yunwei (Ryan) Li (University of Alberta, Canada) ; publication chairs: Xiaonan Lu (Temple University, USA), Carl Ho (University of Manitoba, Canada), Xu She (United Technologies Corporation, USA)
Page(s)/Article-Nr.: 3178-3185