Design challenges and solutions for the practical application of SiC power modules : exemplified by an automotive dc-dc converter

Sewergin, Alexander; de Doncker, Rik W. (Thesis advisor); März, Martin (Thesis advisor)

Aachen : ISEA (2021)
Book, Dissertation / PhD Thesis

In: Aachener Beiträge des ISEA 154
Page(s)/Article-Nr.: 1 Online-Ressource : Illustrationen, Diagramme

Dissertation, Rheinisch-Westfälische Technische Hochschule Aachen, 2021

Abstract

Since the introduction and commercial availability of widebandgap power semiconductors (WBG semiconductors), such as silicon carbide (SiC) and gallium nitride (GaN), it has become possible to meet the increased demands on power electronics, due to the superior switching characteristics of WBG devices compared to silicon-based (Si) power semiconductors. However, these novel WBG semiconductors, SiC in particular, are encapsulated in state-of-the-art packages, which were previously designed for Si power-pemiconductors. These types of packages are used worldwide in industry, but the exploitation of the WBG semiconductors‘ full potential is limited by the parasitic elements of these classical packages. In this work, a SiC dc-dc converter for automotive applications, based on a SiC drop-in replacement module, is developed and used to identify the existing drawbacks of the state-of-the-art package. Based on the results, proposed solutions for the next generation of power semiconductor packages are derived and verified by means of novel prototypes.