Thermal Modeling of Electrical Machines with Advanced Fluid Cooling

Xu, Huihui; Lin, Kunpeng; Ehrenpreis, Claas; Roux, Gregoire; de Doncker, Rik W.

Piscataway, NJ : IEEE (2020, 2021)
Contribution to a book, Contribution to a conference proceedings

In: Proceedings of the Nineteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : ITherm 2020 : ITherm Virtual Conference, July 21-23, 2020 (originally scheduled for May 26-29, 2020), Walt Disney World, Orlando, FL, USA / IEEE, IEEE Electronic Packaging Society
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