Physically-motivated Figure of Merit (FOM) assessing the cooling performance of fluids suitable for the direct cooling of electrical components

Ehrenpreis, Claas (Corresponding author); El Bahi, Hakim; Xu, Huihui; Roux, Gregoire; Kneer, Reinhold; Rohlfs, Wilko

Piscataway, NJ : IEEE (2020)
Buchbeitrag, Beitrag zu einem Tagungsband (After Call)

In: Proceedings of the Nineteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems : ITherm 2020 : ITherm Virtual Conference, July 21-23, 2020 (originally scheduled for May 26-29, 2020), Walt Disney World, Orlando, FL, USA / IEEE, IEEE Electronic Packaging Society
Seite(n)/Artikel-Nr.: 422-429