Thermal Monitoring of Power Electronic Modules with Minimal Sensing Effort

Piscataway, NJ / IEEE (2019) [Contribution to a book, Contribution to a conference proceedings]

ECCE 2019 : IEEE Energy Conversion Congress & Expo : Baltimore, MD, Sept. 29-Oct. 3 / sponsored by the IEEE Power Electronics and Industry Applications Societies ; IEEE
Page(s): 5989-5996

Authors

Authors

van der Broeck, Christoph Henrik
de Doncker, Rik W.

Identifier