Ultra-High Power Density Full-SiC Boost Converter Enabled by Advanced 3D-Printing Techniques

New York, NY / IEEE (2019) [Buchbeitrag, Beitrag zu einem Tagungsband]

APEC 2019 : Thirty-Fourth Annual IEEE Applied Power Electronics Conference : March 17-21, 2019, Anaheim, California / the sponsors: Power Sources Manufacturers Association, IEEE Power Electronics Society, IEEE Industry Applications Society
Seite(n): 1281-1288

Autorinnen und Autoren

Autorinnen und Autoren

Wienhausen, Arne Hendrik
Sewergin, Alexander
de Doncker, Rik W.

Identifikationsnummern