Spatially-Varying Electrothermal Impedance Analysis for Designing Power Semiconductor Converter Systems

Polom, Timothy A. (Corresponding author); van der Broeck, Christoph Henrik (Corresponding author); de Doncker, Rik W.; Lorenz, Robert D.

Piscataway, NJ : IEEE (2019)
Contribution to a book, Contribution to a conference proceedings (After Call)

In: Proceedings of the Eighteenth InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - ITherm 2019 : May 28-31, 2019, the Cosmopolitan of Las Vegas, Las Vegas, NV USA / IEEE, IEEE Electronics and Packaging Society
Page(s)/Article-Nr.: 117-126

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