A thermal modeling methodology for power semiconductor modules
van der Broeck, Christoph Henrik (Corresponding author); Conrad, Marcus; de Doncker, Rik W.
Amsterdam [u.a.] : Elsevier (2015)
Contribution to a conference proceedings, Journal Article
In: Microelectronics reliability
Volume: 55
Issue: 9/10
Page(s)/Article-Nr.: 1938-1944
Identifier
- DOI: 10.1016/j.microrel.2015.06.102
- RWTH PUBLICATIONS: RWTH-2016-00033