Compact High Temperature Package with Smart Size Optimized Gate Drive Unit for Assembling the Dual-ICT

Piscataway, NJ / IEEE service center (2012) [Buchbeitrag, Beitrag zu einem Tagungsband]

2012 IEEE Energy Conversion Congress and Exposition (ECCE 2012) : Raleigh, North Carolina, USA, 15 - 20 September 2012 / [sponsored by the IEEE Power Electronics and Industry Applications Societies]
Seite(n): 464-470

Autorinnen und Autoren

Autorinnen und Autoren

Butschen, Thomas
Wang, Zhan
Kaymak, Murat
de Doncker, Rik W.

Identifikationsnummern