Integrated Cooling Channels in Direct Bonded Copper Substrates for Silicon Carbide MOSFETs

  • Integrierte Kühlkanäle in Direct Bonded Copper Substraten für Siliziumkarbid MOSFETs

Stippich, Alexander (Corresponding author); Battefeld, Maximilian; de Doncker, Rik W.

Frankfurt am Main] : VDE (2018)
Contribution to a book, Contribution to a conference proceedings

In: PCIM Europe 2018 : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management : 5-7 June 2018 / [organizer: Mesago PCIM GmbH, Stuttgart]
Page(s)/Article-Nr.: 1400-1407


  • Institute of Power Electronics and Electrical Drives [614500]
  • Chair of Power Electronics and Electrical Drives [614510]