Highly Integrated 200 kW SiC Three-Phase Dual-Active-Bridge Converter with 3D-Printed Fluid Coolers
David Bundgen, André Thönnessen, Niklas Fritz, Tobias Kamp, Rik W. De Doncker, The 8th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 10. November 2021.
This work features a highly efficient high power density dc-dc converter based on a soft switching capable, dual-active-bridge topology. Moreover, to reduce switching losses at high frequencies and consequently minimize the size of the passive components, modern 1200 V silicon carbide half bridge modules are used. Furthermore, to decrease the size of the cooling apparatus, compact 3D-printed fluid coolers are utilized. These measures that has been stated previously resulted in a highly integrated active part of the converter with a total box volume of 8 dm3 including the semiconductor switches, capacitors and sensors for a 200 kW unit. The first prototype shows a power density capability of 6.48 kW/dm3 at a maximum power output of 201 kW. The design of this converter and its advanced cooling concept as well as in-operation measurements will be presented.