Integrated Cooling Channels in Direct Bonded Copper Substrates for Silicon Carbide MOSFETs

Nuremberg / VDE (2018) [Contribution to a book]

PCIM Europe 2018; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
Page(s): 1400-1407

Authors

Selected Authors

Stippich, Alexander
Battefeld, Maximilian
de Doncker, Rik W.

Identifier

  • REPORT NUMBER: RWTH-2018-226195